| 摘要 |
Embodiments described herein provide methods and apparatus for thermally treating a substrate. A first radiant energy source that delivers a first radiation at a first fluence and a second radiant energy source that delivers a second radiation at a second fluence are disposed to direct energy toward a substrate support positioned to receive the first radiation at a first location and the second radiation at a second location, wherein the first fluence is 10 to 100 times the second fluence and the first radiation cannot reach the second location. The first radiant energy source may be a laser, and the second radiant energy source may be a plurality of lasers, for example a pulsed laser assembly with a plurality of pulsed lasers. The second radiant energy source may also be a flash lamp. The first and second radiant energy sources may be in the same chamber or different chambers. |
