发明名称 METHOD AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A method for manufacturing a semiconductor device is provided. The method contains steps of providing the semiconductor device including a working area; directing a medium flow onto the working area; configuring a lens in contact with the medium flow; and directing a laser beam to the working area through the lens and the medium flow. A laser processing for manufacturing a semiconductor device is also provided.
申请公布号 US2014154871(A1) 申请公布日期 2014.06.05
申请号 US201213691561 申请日期 2012.11.30
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COM, LTD. 发明人 Hwang Chien-Ling;Jang Bor-Ping;Hsiao Yi-Li;Liao Hsin-Hung;Liu Chung-Shi
分类号 H01L21/263;B23K26/38 主分类号 H01L21/263
代理机构 代理人
主权项 1. A laser processing system for manufacturing a semiconductor device including a working area, comprising: a laser beam outlet providing therethrough a laser beam to the working area; and a medium providing device including a first passage, a second passage and a bridging part connected therebetween for providing a medium onto the working area via the first passage and collecting the medium from the working area via the second passage to form a medium flow on the working area, wherein the bridging part is connected with the laser beam outlet.
地址 Hsinchu City TW