| 发明名称 |
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
A light-emitting device includes: a substrate; a light-emitting element mounted on the substrate, with a surface opposite to a light-emitting surface facing the substrate; a first resin encapsulant which covers the light-emitting element such that at least part of the light-emitting surface is exposed; and a second resin encapsulant provided on and in contact with the first resin encapsulant and the light-emitting surface. The first resin encapsulant contains a light reflective material. The second resin encapsulant has a function of converting first light emitted by the light-emitting element into second light of different wavelength, and a function of mixing the first light and the second light. |
| 申请公布号 |
US2014151734(A1) |
申请公布日期 |
2014.06.05 |
| 申请号 |
US201414147426 |
申请日期 |
2014.01.03 |
| 申请人 |
PANASONIC CORPORATION |
发明人 |
ITO Kenichi;IDE Yoshiyuki;USUKUBO Hideaki;NAKATSU Koji;UCHIDA Takafumi |
| 分类号 |
H01L33/52;H01L33/58 |
主分类号 |
H01L33/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting device, comprising:
a substrate; a light-emitting element mounted on the substrate, with a surface opposite to a light-emitting surface facing the substrate; a first resin encapsulant which covers the light-emitting element such that at least part of the light-emitting surface is exposed; and a second resin encapsulant provided on and in contact with the first resin encapsulant and the light-emitting surface, wherein the first resin encapsulant contains a light reflective material, and the second resin encapsulant includes a first layer containing a light wavelength conversion material which absorbs first light and emits second light, and a transparent resin layer provided under the first layer and in contact with the light-emitting surface.
|
| 地址 |
Osaka JP |
