A memory module comprises a plurality of memory devices and a buffer chip. The buffer chip manages the operations of the plurality of memory devices. The buffer chip includes a memory management unit having an error correction unit to perform the error correction operation for each of the memory devices. Each of the memory devices includes at least one spare column which can be accessed from the memory management unit. The memory management unit corrects the errors of the plurality of memory devices by selectively using the spare column depending on the error correction capability of the error correction unit.
申请公布号
KR20140067875(A)
申请公布日期
2014.06.05
申请号
KR20130025385
申请日期
2013.03.11
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
SON, JONG PIL;KANG, UK SONG;PARK, CHUL WOO;SOHN, YOUNG SOO