PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

One embodiment of the present invention provides a printed circuit board including a core layer; a conductive via formed on a via hole of the core layer; an upper land formed on the upper surface of the conductive via; and a lower land formed on the lower surface of the conductive via. The center of the upper land is different from the center of the lower land on a plane. The present invention can reduce damage to the printed circuit board by improving durability of an insulation area with pressure in a wet process as the center of the upper land formed on the board and the center of the lower land are differently located.