| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element mounting substrate and a manufacturing method of the same, which achieve high adhesion between an electrode layer and a resin.SOLUTION: A semiconductor element mounting substrate manufacturing method comprises: a) a process of forming a resist layer composed of two layers of a lower resist layer 30 and an upper resist layer 41 by using resists having main photosensitive wavelengths different from each other on a surface of a metal plate 20; b) a process of exposing the upper resist layer in a predetermined pattern in a state where the lower resist layer is un exposed; c) a development process of forming an opening of the predetermined pattern in the upper resist layer and forming an opening in the lower resist layer in the unexposed state in the pattern of the upper resist layer to partially expose the surface of the metal plate; d) a process of exposing the lower resist layer to cure the lower resist layer; e) a process of forming predetermined plating on the metal plate exposed from the lower resist layer; f) a process of making a surface of a plating layer to be a rough surface by an etching treatment; g) a process of performing noble metal plating for bonding on the rough surface; and h) a process of peeling all the resist layers. |
