| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board on which metal bumps having an upper surface of large area are formed without producing resin residue.SOLUTION: A circuit board comprises: a base metal substrate 2 composed of one kind selected from copper, copper alloy, and aluminum; metal bumps 3 formed on the base metal substrate 2, having an upper surface of large area, and composed of a metal selected from copper, copper alloy, aluminum, and nickel; an insulation resin layer 4 formed around the side face of the metal bumps 3; and a metal layer (metal layer 5 and metal plating layer 6) formed on the insulation resin layer 4. The height from the bottom of the base metal substrate 2 to the upper surface of the metal plating layer 6 is identical to the height from the bottom of the base metal substrate 2 to the upper surface of the metal plating layer 6 on the insulation resin layer 4.</p> |
