| 摘要 |
The present invention relates to a fingerprint recognition sensor package and a manufacturing method thereof and, more specifically, to a fingerprint recognition sensor package and a manufacturing method thereof comprising a substrate; a fingerprint recognition sensor mounted on the upper surface of the substrate and obtaining a fingerprint image when a fingerprint touches the sensor; a via hole penetrating the fingerprint recognition sensor from the edge of the fingerprint recognition sensor; and a connection portion formed on the lower surface of the fingerprint recognition sensor and electrically connecting the fingerprint recognition sensor and the substrate in contact with the via hole. In the case of the present invention, the fingerprint recognition sensor not only reduces the size of the fingerprint recognition sensor package as compared with the conventional sensor but also improves a fingerprint recognition rate. |
