| 摘要 |
The present invention relates to a carrier head of a chemical mechanical polishing apparatus and a membrane used for the same. The membrane, which is located in a lower part of a pressure chamber of the carrier head for the chemical mechanical polishing apparatus is made of an elastic material and is expanded according to the pressure of the pressure chamber, includes a horizontal part which touches a wafer for a chemical mechanical polishing process, a main membrane of a first flexible material having an end extension part which is bent from an edge of the horizontal part to an upper part; and a reinforcement membrane which partly surrounds the end extension part of the first membrane to be integrated and is made of a second flexible material with a higher hardness compared to the first flexible material. The provided carrier head of the chemical mechanical polishing apparatus and the membrane used for the same which constantly maintain a pressure which is applied to the wafer due to the expansion of the pressure chamber of the carrier head on the entire surface of the wafer. |
