| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition particularly as a permanent resist having characteristics necessary for a MEMS package, a semiconductor package, and a component for forming a microreactor, the composition being able to form a pattern with a fine and perpendicular side wall profile by photolithography, and the cured product having characteristics excellent in low stress, moisture-heat resistance, and high adhesiveness.SOLUTION: The photosensitive resin composition comprises (A) an epoxy resin, (B) a polyol compound, (C) a photo-cationic polymerization initiator, (D) an epoxy group-containing silane compound and (E) a reactive epoxy monomer, wherein the (A) epoxy resin comprises an epoxy resin (a) obtained by the reaction of a tetranuclear phenol derivative and an epihalohydrin, and an epoxy resin (b) expressed by formula (2) below; and the (E) reactive epoxy monomer is a polyglycidyl ether of a polyhydric alcohol. |
