| 发明名称 |
BUMP-EQUIPPED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING BUMP-EQUIPPED ELECTRONIC COMPONENT |
| 摘要 |
A bump-equipped electronic component includes a circuit substrate and first and second bumps which are disposed on a principal surface of the circuit substrate and have different cross-sectional areas in a direction parallel or substantially parallel to the principal surface. One of the first and second bumps having a smaller cross-sectional area includes a height adjustment layer disposed in a direction perpendicular or substantially perpendicular to the principal surface. |
| 申请公布号 |
US2014151874(A1) |
申请公布日期 |
2014.06.05 |
| 申请号 |
US201314096044 |
申请日期 |
2013.12.04 |
| 申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
OBU Isao;OSAKABE Shinya |
| 分类号 |
H01L23/498;H01L21/768 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bump-equipped electronic component comprising:
a circuit substrate; and first and second bumps disposed on a principal surface of the circuit substrate and having different cross-sectional areas in a direction parallel or substantially parallel to the principal surface; wherein one of the first and second bumps having a smaller cross-sectional area includes a height adjustment layer disposed in a direction perpendicular or substantially perpendicular to the principal surface.
|
| 地址 |
Nagaokakyo-shi JP |
