| 摘要 |
A light emitting device package includes a package substrate and a light emitting device mounted on the package substrate. The package substrate includes: a first conductive region and a second conductive region with parts overlapped with the light emitting device; an electrode separation part which is extended across the package substrate while penetrating the package substrate; and a stress release part which is extended to surround at least one portion of the first conductive region and at least one portion of the second conductive region from the edge of the package substrate, and has different widths at both sides across the electrode separation unit. |
