APPARATUS FOR ALIGNING SUBSTRATE

摘要

The present invention relates to a substrate aligning device which is characterized by including transferring units which transfer substrates; sensing units which sense the misalignment of the substrates; injecting units which inject high-pressure air to align the substrates in a preset direction; and a control unit which receives signals from the sensing units and then controls the operation of the injecting units. Therefore, by using high-pressure air, the substrate aligning device can minimize damage to the substrates that might occur in an existing mechanical aligning method.