发明名称 |
PRINTED CIRCUIT BOARD |
摘要 |
The present invention provides a printed circuit board, capable of reducing bending deflection while maintaining a thin thickness by inserting a hardness reinforcing layer into a soft printed circuit board, and a manufacturing method for the same. The printed circuit board of the present invention includes: an inner layer formed of the soft circuit board; an outer insulation layer formed on one or more sides among one surface or the other surface of the inner layer; and an outer core layer including the inner layer and the reinforcing layer formed of a hardness material having greater strength than the outer insulation layer. |
申请公布号 |
KR20140067885(A) |
申请公布日期 |
2014.06.05 |
申请号 |
KR20130055206 |
申请日期 |
2013.05.15 |
申请人 |
DAEDUCK GDS CO., LTD. |
发明人 |
HWANG, JEONG HO;SHIN, YUN CHAL;LEE, CHOONG SEAK |
分类号 |
H05K3/46;H04N5/225;H05K1/02 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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