发明名称 PRINTED CIRCUIT BOARD
摘要 The present invention provides a printed circuit board, capable of reducing bending deflection while maintaining a thin thickness by inserting a hardness reinforcing layer into a soft printed circuit board, and a manufacturing method for the same. The printed circuit board of the present invention includes: an inner layer formed of the soft circuit board; an outer insulation layer formed on one or more sides among one surface or the other surface of the inner layer; and an outer core layer including the inner layer and the reinforcing layer formed of a hardness material having greater strength than the outer insulation layer.
申请公布号 KR20140067885(A) 申请公布日期 2014.06.05
申请号 KR20130055206 申请日期 2013.05.15
申请人 DAEDUCK GDS CO., LTD. 发明人 HWANG, JEONG HO;SHIN, YUN CHAL;LEE, CHOONG SEAK
分类号 H05K3/46;H04N5/225;H05K1/02 主分类号 H05K3/46
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