| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor module capable of obtaining inexpensive and strong bonding, and a method of manufacturing the same.SOLUTION: A semiconductor chip 10 is mounted on a mounting substrate 20 by bonding a first electrode part 12 of the semiconductor chip 10 to a second electrode part 22 of the mounting substrate 20. In the first electrode part 12 and the second electrode part 22, a first copper nitride thin film is formed on a surface of a first copper electrode body 12a, and a second copper nitride thin film is formed on a surface of a second copper electrode body 22a by irradiation with nitrogen plasma. Then, the first copper nitride thin film and the second copper nitride thin film are brought into contact with each other and are heat-treated while being pressurized, thereby bonding the first electrode part 12 to the second electrode part 22 with a copper nitride 32 interposed therebetween.</p> |
