| 摘要 |
Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers. |
| 主权项 |
1. A fabrication process for forming a multi-layer three-dimensional structure, comprising:
(a) forming and adhering a layer, comprising at least a first material and a second material, one of which is a structural material and the other of which is a sacrificial material, to a previously formed layer; and (b) repeating the forming and adhering of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers, wherein the three-dimensional structure is formed from at least one of the first and second materials; wherein formation of at least a given layer and a subsequent layer adjacent to the given layer, of the plurality of layers, comprises:
(1) depositing a first material for the given layer, onto a previously deposited material to form a portion of the given layer, wherein a height of deposition exceeds a desired boundary of the given layer;(2) planarizing the surface of the deposited first material to set a level that defines the desired boundary for the given layer;(3) selectively etching into the first material on the given layer to a desired depth to create voids in the first material of the given layer such that the voids extend through the given layer;(4) depositing a second material for the given layer which is also a first material for the subsequent layer to form a portion of the given layer and to form a portion of the subsequent layer, wherein a height of deposition exceeds a desired boundary of the subsequent layer;(5) planarizing the surface of the deposited first material for the subsequent layer, to set a level that is no less than a a level of a desired boundary for the subsequent layer; and(6) selectively etching into the first material for the subsequent layer to a desired depth to create voids in the subsequent layer such that the voids in the first material of the subsequent layer extend through the subsequent layer to at least the desired boundary of the given layer; (c) after the repeating of the forming and adhering the plurality of times, removing at least a portion of the sacrificial material from the structural material to reveal the multi-layer three-dimensional structure formed from the structural material.
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