发明名称 ELECTROPLATING PROCESSOR WITH THIN MEMBRANE SUPPORT
摘要 An electroplating processor includes a thin lower membrane support for supporting a membrane. The lower membrane support may be provided as a flexible plastic sheet having a pattern of through-openings. The through-openings may be aligned with openings in a rigid upper membrane support. The perimeter of the lower membrane may be clamped in the same perimeter seal as used to clamp and seal the perimeter of the membrane. The lower membrane support supports the membrane without adding significantly to the overall height of the processor. The processor can be stacked in a two level processing system without requiring additional clean room space.
申请公布号 US2014151218(A1) 申请公布日期 2014.06.05
申请号 US201313830131 申请日期 2013.03.14
申请人 APPLIED MATERIALS, INC. 发明人 Woodruff Daniel J.
分类号 C25D17/00 主分类号 C25D17/00
代理机构 代理人
主权项 1. An electroplating processor comprising: a bowl; a membrane in the bowl; an upper membrane support in the bowl above the membrane; and a lower membrane support in the bowl below the membrane, with the lower membrane support comprising a flexible sheet having a pattern of through openings.
地址 Santa Clara CA US