ATOMIC LEVEL BONDING FOR ELECTRONICS PACKAGING

摘要

An electronic device assembly that includes a die and a substrate, and optionally a lead frame and a heat spreader. The die is characterized as an electronic device in die form, and has a polished die region. The substrate has a polished substrate region in direct contact with the polished die region. The polished die region and the polished substrate region have surface finishes effective to attach the die to the substrate by way of an atomic bond. The lead-frame has a polished lead-frame region, and the heat spreader has a polished heat spreader region. These polished regions may also be attached to the polished die region or the polished substrate region by way of an atomic bond.

主权项

1. An electronic device assembly comprising:
a die characterized as an electronic device in die form, said die having a polished die region; a substrate having a polished substrate region in direct contact with the polished die region, wherein the polished die region and the polished substrate region have surface finishes effective to attach the die to the substrate by way of an atomic bond; a lead frame having a polished lead-frame region in direct contact with the polished substrates region, wherein the polished lead-frame region and the polished substrate region have surface finishes effective to attach the die to the substrate by way of an atomic bond; and a heat spreader having a polished heat spreader region in direct contact with the polished substrate region, wherein the polished heat spreader region and the polished substrate region have surface finishes effective to attach the heat spreader to the substrate by way of an atomic bond.