| 摘要 |
The present invention relates to a lid assembly of a plasma treatment device to spray uniform process gas on a wafer in a process chamber. The objective of the present invention is to widely supply a lid assembly which can uniformly spray process gas on the surface of a wafer. To this end, the lid assembly according to the present invention comprises an outer spray device having at least one radial passage formed on the disk-shaped upper surface thereof; a central spray device provided in a center through hole of the outer spray device; a lid heater base having at least two rows of first and second through holes radially formed on the bottom of a groove formed in the center part thereof which is formed in a disk shape to cover the top of the central and outer spray devices so that process gas can be supplied to a spray hole of the central spray device and the radial passage of the outer spray device; and a distribution device consisting of annular first and second passages having one side surface opened to be connected to the first and second through holes of the lid heater base and first and second supply holes respectively connected to the first and second passages to supply the process gas. Accordingly, the lid assembly having a structure capable of uniformly spraying process gas on the surface of a wafer can be widely supplied, and process uniformity of a semiconductor manufacturing process can be precisely adjusted by uniformly spraying the process gas on the wafer, thereby improving productivity. |
