发明名称 METAL-CERAMICS JOINING SUBSTRATE AND METHOD OF PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a metal-ceramics joining substrate having excellent joining strength between a ceramics substrate and a metal plate, and further having excellent heat cycle resistance, and a method of producing the same.SOLUTION: In such a manner that the residual stress of a ceramics substrate 10 made of an aluminum nitride sintered compact is controlled to -50 MPa or less, the arithmetic average roughness Ra of a joint face with a metal plate 14 in the ceramics substrate 10 is controlled to 0.15 to 0.30 μm, the ten-point average roughness Rz is controlled to 0.7 to 1.1 μm, the maximum height Ry is controlled to 0.9 to 1.7 μm, the deflective strength of the ceramics substrate 10 is controlled to 500 MPa or less, and the thickness of a residual stress layer 10a formed along the surface of the ceramics substrate 10 is controlled to 25 μm or less, wet blast treatment of jetting slurry including spherical alumina as granules in a liquid to the surface of the ceramics substrate 10 is performed, and thereafter, the ceramics substrate 10 obtained by the wet blast treatment is joined with the metal plate 14 made of copper or a copper alloy via a brazing filler metal 12.
申请公布号 JP2014101248(A) 申请公布日期 2014.06.05
申请号 JP20120253812 申请日期 2012.11.20
申请人 DOWA METALTECH KK;TOKUYAMA CORP 发明人 OSANAI HIDEYO;KITAMURA MASAHIRO;AOKI HIROTO;KANECHIKA YUKIHIRO;SUGAWARA KEN;TAKEDA YASUKO
分类号 C04B37/02;H05K1/02;H05K1/03;H05K3/38 主分类号 C04B37/02
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