发明名称 IMPRINT MOLD AND METHOD FOR MANUFACTURING IMPRINT MOLD, METHOD FOR FORMING PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an imprint mold in which a capillary force acting on a developing solution or a photosetting resin is taken into consideration, an imprint mold with which a pattern with high accuracy can be formed by a nanoimprint process, a method for forming a pattern, and a method for manufacturing a semiconductor device.SOLUTION: The method for manufacturing an imprint mold comprises: irradiating a desired portion of an actinic ray-sensitive resist layer formed on a substrate with actinic rays on the basis of a temporary design pattern data; developing the resist layer by using a developing solution to form a resist pattern; etching the substrate through the resist pattern to manufacture a temporary master mold having a pattern of a rugged structure; detecting a defect generation position in the pattern of the temporary master mold to obtain statistics on defect generation positions; specifying a defect inducing pattern that influences a flow of a developing solution and induces generation of a defect, from the statistic results; creating a corrected design pattern data in which a flow of the developing solution at the defect inducing pattern portion in the temporary design pattern data is corrected; and manufacturing a master mold on the basis of the corrected design pattern data.
申请公布号 JP2014103294(A) 申请公布日期 2014.06.05
申请号 JP20120254967 申请日期 2012.11.21
申请人 DAINIPPON PRINTING CO LTD 发明人 ITO KIMIO;HIRAKA TAKAAKI
分类号 H01L21/027;B29C33/38;B29C59/00 主分类号 H01L21/027
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