| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method capable of achieving monitoring of a polishing progress and improved precision of polishing end point detection.SOLUTION: In the polishing method, at least one measurement region 61 with no wiring pattern is provided within a surface of a substrate W, the substrate W is polished by a sliding contact between the substrate W and a polishing pad 10 and, during polishing of the substrate W, a film thickness in the measurement region 61 is measured with a film thickness sensor 40. Polishing of the substrate W is monitored based on a film thickness signal obtained in the measurement region 61. |
