| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor evaluation device capable of grasping a contact load to a measured object, of a contact probe, and appropriately dealing with failures and breakage of the contact probe.SOLUTION: A semiconductor evaluation device comprises a socket 19, an insulation base substance 16, and a pressure detector 7. The socket 19 is an installation jig to which a contact probe is detachably installed. The insulation base substance 16 is a holding member slidably holding the socket 19 depending on a contact pressure of the contact probe. The pressure detection part 7 is attached to the socket 19, and is a measurement part for measuring a contact load added from the contact probe to the semiconductor device, by sliding of the socket 19. |
