POLISHING PAD

摘要

A polishing pad includes at least a cushion layer and a polishing layer including a groove, on a polishing surface, having side surfaces and a bottom surface, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle α with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle β with a plane parallel to the polishing surface, the angle α is larger than 90 degrees, the angle β is not smaller than 85 degrees, and the angle β is smaller than the angle α, a bending point depth is not less than 0.4 mm and not more than 3.0 mm, and the cushion layer has a distortion constant of not less than 7.3×10−6 μm/Pa and not more than 4.4×10−4 μm/Pa.

主权项

1. A polishing pad comprising at least a polishing layer and a cushion layer, wherein
the polishing layer comprises a groove on a polishing surface, the groove having side surfaces and a bottom surface, at least one of the side surfaces comprises a first side surface that extends continuously to the polishing surface and forms an angle α with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle β with a plane parallel to the polishing surface, the angle α formed with the polishing surface is larger than 90 degrees, the angle (β formed with the plane parallel to the polishing surface is not smaller than 85 degrees, and the angle β formed with the plane parallel to the polishing surface is smaller than the angle α formed with the polishing surface, a bending point depth from the polishing surface to a bending point between the first side surface and the second side surface is not less than 0.4 mm and not more than 3.0 mm, and the cushion layer has a distortion constant of not less than 7.3×10−6 μm/Pa and not more than 4.4×10−4 μm/Pa.