发明名称 HIGH TEMPERATURE SUPERCONDUCTING WIRE
摘要 The present invention relates to a high temperature superconducting wire comprising a preliminary superconducting wire layer formed by forcibly removing a metal substrate from a superconducting wire including the metal substrate, a buffer layer formed on the upper surface of the metal substrate, and a superconductor layer formed on the upper surface of the buffer layer; a silver (Ag) protective layer formed on the lower surface of the preliminary superconducting wire layer; and a copper (Cu) protective layer formed on the lower surface of the silver protective layer. According to the high temperature superconducting wire of the present invention, magnetic losses due to the magnetism of the substrate can be reduced and the stability of the wire can be improved since the superconducting wire is formed by forming the metal protective layer after stripping the metal substrate of the second generation high temperature superconducting wire, and Je (engineering current density) can be increased since the thickness of the superconducting wire is minimized.
申请公布号 KR20140067495(A) 申请公布日期 2014.06.05
申请号 KR20120134793 申请日期 2012.11.26
申请人 KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE 发明人 KO, ROCK KIL;SOHN, MYUNG HWAN;JO, YOUNG SIK;HA, DONG WOO;KANG, BOO MIN;KIM, DONG HYUK
分类号 H01B12/06 主分类号 H01B12/06
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