发明名称 |
MODULE STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a module structure.SOLUTION: The invention discloses a module structure including a front sheet, a back sheet, and an optoelectronic device provided between the front sheet and the back sheet. A first sealing layer is provided between the optoelectronic device and the front sheet. The back sheet has a lamination structure including a hydrogenation styrene elastomer resin layer and a polyolefin layer. The hydrogenation styrene elastomer resin layer is provided between the optoelectronic device and the polyolefin layer. |
申请公布号 |
JP2014103399(A) |
申请公布日期 |
2014.06.05 |
申请号 |
JP20130240024 |
申请日期 |
2013.11.20 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;KUO HSIN TECHNOLOGY CO LTD |
发明人 |
WANG WEN-HSIEN;KUAN MIN-TSUNG;LI HSUN-TIEN;SHU BUNKEN;LIN FU-MING;LEE WEN-KUEI;YEH CHIN ZENG;CHEN MING-HUNG;HUANG CHUNG-TENG;FU HSUEH JEN |
分类号 |
H01L31/042;B32B27/30;B32B27/32 |
主分类号 |
H01L31/042 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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