发明名称 MODULE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a module structure.SOLUTION: The invention discloses a module structure including a front sheet, a back sheet, and an optoelectronic device provided between the front sheet and the back sheet. A first sealing layer is provided between the optoelectronic device and the front sheet. The back sheet has a lamination structure including a hydrogenation styrene elastomer resin layer and a polyolefin layer. The hydrogenation styrene elastomer resin layer is provided between the optoelectronic device and the polyolefin layer.
申请公布号 JP2014103399(A) 申请公布日期 2014.06.05
申请号 JP20130240024 申请日期 2013.11.20
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;KUO HSIN TECHNOLOGY CO LTD 发明人 WANG WEN-HSIEN;KUAN MIN-TSUNG;LI HSUN-TIEN;SHU BUNKEN;LIN FU-MING;LEE WEN-KUEI;YEH CHIN ZENG;CHEN MING-HUNG;HUANG CHUNG-TENG;FU HSUEH JEN
分类号 H01L31/042;B32B27/30;B32B27/32 主分类号 H01L31/042
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