| 发明名称 |
CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES |
| 摘要 |
A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module. |
| 申请公布号 |
US2014150839(A1) |
申请公布日期 |
2014.06.05 |
| 申请号 |
US201414176388 |
申请日期 |
2014.02.10 |
| 申请人 |
Laird Technologies, Inc. |
发明人 |
Hershberger Jeffrey Gerard;Hill Richard F.;Smythe Robert Michael;Sutsko Michael G. |
| 分类号 |
F25B21/02;H01L35/30 |
主分类号 |
F25B21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit assembly comprising:
a circuit board; a thermoelectric module; and at least one electrical pathway coupling the thermoelectric module to the circuit board; wherein the circuit board forms at least part of the thermoelectric module; and wherein the circuit board can support electrical components on the circuit board at locations spaced apart from the thermoelectric module.
|
| 地址 |
Earth City MO US |
