ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

摘要

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

主权项

1. A microelectronic assembly, comprising:
a first substrate having a surface and a first conductive element; a second substrate having a surface and a second conductive element; and an electrically conductive alloy mass joined to the first and second conductive elements, wherein the conductive alloy mass includes a first material, a second material, and a third material, the third material selected to increase the melting point of an alloy including the third material and at least one of the first material or the second material, wherein a concentration of the first material varies from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and wherein a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.