发明名称 SHIELD STRUCTURE FOR ELECTRONIC APPARATUS
摘要 A shield structure for an electronic apparatus includes a frame member and a shield box. The frame member is a conductive frame to which the wiring substrate is attached and covering a back surface of the wiring substrate. The shield box is formed on a front surface of the wiring substrate having an electronic component mounted thereon, to cover an area of a portion of the front surface. The wiring substrate includes a plurality of connecting portions formed thereon that ground the front surface and the back surface to the frame member. On a side on which the wiring substrate protrudes from the shield box, the shield box includes a shield wall member forming a wall surface substantially perpendicular to the wiring substrate. The shield wall member is grounded to at least one location of the connecting portions of the wiring substrate in the vicinity of the wall surface.
申请公布号 US2014151110(A1) 申请公布日期 2014.06.05
申请号 US201314091058 申请日期 2013.11.26
申请人 KYOCERA Document Solutions Inc. 发明人 Masaki Akihiro;Okauchi Yoshifumi
分类号 H05K9/00 主分类号 H05K9/00
代理机构 代理人
主权项 1. A shield structure for an electronic apparatus that shields an area of a portion of a wiring substrate attached to an electronic apparatus, comprising: a conductive frame member to which the wiring substrate is attached and covering a back surface of the wiring substrate; and a shield box formed on a front surface of the wiring substrate so as to cover an area of a portion of the front surface, the front surface having an electronic component mounted thereon, wherein the wiring substrate includes a plurality of connecting portions formed thereon that ground the front surface and the back surface to the frame member, and, on a side on which the wiring substrate protrudes from the shield box, the shield box includes a shield wall member forming a wall surface substantially perpendicular to the wiring substrate, and the shield wall member is grounded to at least one location of the connecting portions of the wiring substrate in the vicinity of the wall surface.
地址 Osaka JP