摘要 |
<p>Device for thermal treatment of substrates (2) in a treatment chamber, comprises (a) a transport device in the treatment chamber for transporting the substrates, (b) a gas conducting device (8) for supplying and discharging an inert gas, and (c) a radiation device in the treatment chamber, for irradiating the substrates, which is arranged immediately above the surface of the substrates, and comprises at least one electrode pair (5) comprising an anode (52), a cathode (51) and a discharge chamber, in which a gas discharge with emission of electromagnetic radiation, is generated. Device for thermal treatment of substrates (2) in a treatment chamber, comprises (a) a transport device in the treatment chamber for transporting the substrates, (b) a gas conducting device (8) for supplying and discharging an inert gas, and (c) a radiation device in the treatment chamber, for irradiating the substrates, which is arranged immediately above the surface of the substrates, and comprises at least one electrode pair (5) comprising an anode (52), a cathode (51) and a discharge chamber between the anode and the cathode, in which a gas discharge with emission of electromagnetic radiation, is generated. The anode and the cathode are respectively connected to a voltage supply. Independent claims are also included for: (1) a system for producing and subsequently thermally treating coated substrates, comprising a device for depositing thin functional layers on the substrates at low temperature, and the above device for thermal treatment of substrates; (2) thermally treating the substrates in the treatment chamber, comprising (i) introducing the substrates into the treatment chamber by the transport device, (ii) filling the treatment chamber with an inert gas using the gas conducting device, and (iii) heating the substrates by absorbing the radiation of the radiation device, where upon applying a high voltage between the anode and the cathode, a gas discharge emitting electromagnetic radiation, is generated; and (3) producing and subsequently thermally treating the coated substrates, comprising depositing the thin functional layers on the substrates at low temperature, and the above method.</p> |