| 摘要 |
An electrical assembly (11) comprises a substrate (49) having a dielectric layer (45) and one or more electrically conductive traces (46, 48) overlying the dielectric layer (45). An electrical component (44) is mounted on a first side (146) of the substrate (49). The electrical component (44) is capable of generating heat. A plurality of conductive through holes (47) in the substrate (49) are located around a perimeter of the electrical component (44). The conductive through holes (47) are connected to a conductive trace (46 or 48) for heat dissipation. A cooling cavity (26) has bores (28) that face a second side of the substrate opposite the first side. A plurality of respective compliant pins (32) are inserted into corresponding conductive through holes (47) and the bores (28), wherein a generally exposed portion of the compliant pin (32) is exposed to air or a coolant liquid within the cooling cavity (26). |
