| 摘要 |
A photosensitive resin composition and cured products thereof are provided to prevent the bending due to heating in a process of manufacturing the flexible substrate and post-process or a parts-mounting process, and to show high-sensitivity even if the photopolymerization initiator is added in a small quantity. A photosensitive resin composition comprises carboxyl group-containing resin 100.0 parts by mass; an oxime ester-based photopolymerization initiator 0.1 ~ 1.5 parts by mass, represented by the chemical formula I; and a compound containing two ethylenically unsaturated groups in molecule. The photosensitive resin composition can be developed with the diluted alkali water solution. |
