| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and a semiconductor device which can suppress an increase of electric resistance between a feed-through electrode and a wiring layer. SOLUTION: The wiring board includes a semiconductor substrate, the wiring layer which is formed on at least an upper face of the semiconductor substrate and has a conductor layer and a first insulating layer, the through electrode penetrating the semiconductor substrate and the first insulating layer of the wiring layer, and a second insulating layer formed between the semiconductor substrate and the through electrode. The through electrode has a first conductive part penetrating the first insulating layer of the wiring layer, and a second conductive part which penetrates the semiconductor substrate is electrically connected to the first conductive part, has a cross-sectional area larger than that of the first conductive part, and includes a step face electrically connected to the conductor layer. COPYRIGHT: (C)2011,JPO&INPIT |
