发明名称 An apparatus including a semiconductor device coupled to a decoupling device
摘要 An apparatus and method of forming the same including, in one embodiment, a printed circuit board (430) and a semiconductor device (405) coupled to the printed circuit board (430). The apparatus also includes a decoupling device (440) coupled to the printed circuit board (430) and positioned under the semiconductor device (405).
申请公布号 EP2738807(A2) 申请公布日期 2014.06.04
申请号 EP20130194700 申请日期 2013.11.27
申请人 ENPIRION, INC. 发明人 LOTFI, ASHRAF W.;DEMSKI, JEFFREY;FEYGENSON, ANATOLY;LOPATA, DOUGLAS DEAN;NORTON, JAY;WELD, JOHN D.
分类号 H01L29/417;H01L21/285;H01L21/336;H01L21/768;H01L21/8238;H01L23/00;H01L23/36;H01L23/482;H01L23/495;H01L23/522;H01L23/64;H01L27/02;H01L27/092;H01L29/08;H01L29/10;H01L29/45;H01L29/49;H01L29/66;H01L29/78 主分类号 H01L29/417
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