发明名称 |
MELT-PROCESSABLE, INJECTION-MOLDABLE THERMOPLASTIC POLYMER COMPOSITION AND SEMI-CONDUCTIVE DEVICES FABRICATED THEREWITH |
摘要 |
<p>A thermoplastic, hydrogenated vinyl aromatic/conjugated diene block polymer composition, especially a hydrogenated styrene/butadiene triblock composition, functions well as a LED encapsulating material in that it provides one or more of optical clarity, thermal stability, ultraviolet light resistance, melt-processability and injection-moldability. The resulting LED resists deformation after setting or hardening under typical solder reflow conditions.</p> |
申请公布号 |
EP2318444(B1) |
申请公布日期 |
2014.06.04 |
申请号 |
EP20090791026 |
申请日期 |
2009.07.31 |
申请人 |
USI CORPORATION |
发明人 |
ZHOU, WEIJUN;CHEN, BRIAN;ANSEMS, PATRICIA;HAHN, STEPHEN |
分类号 |
C08F8/04;C08F297/04;C08L53/02;H01L33/00 |
主分类号 |
C08F8/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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