发明名称 MELT-PROCESSABLE, INJECTION-MOLDABLE THERMOPLASTIC POLYMER COMPOSITION AND SEMI-CONDUCTIVE DEVICES FABRICATED THEREWITH
摘要 <p>A thermoplastic, hydrogenated vinyl aromatic/conjugated diene block polymer composition, especially a hydrogenated styrene/butadiene triblock composition, functions well as a LED encapsulating material in that it provides one or more of optical clarity, thermal stability, ultraviolet light resistance, melt-processability and injection-moldability. The resulting LED resists deformation after setting or hardening under typical solder reflow conditions.</p>
申请公布号 EP2318444(B1) 申请公布日期 2014.06.04
申请号 EP20090791026 申请日期 2009.07.31
申请人 USI CORPORATION 发明人 ZHOU, WEIJUN;CHEN, BRIAN;ANSEMS, PATRICIA;HAHN, STEPHEN
分类号 C08F8/04;C08F297/04;C08L53/02;H01L33/00 主分类号 C08F8/04
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