| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistive resin composition which develops a high oxazolation rate even at a low heat curing temperature, and has a high storage stability, and in the case of containing a photosensitive diazoquinone compound, further develops a high oxazolation rate even if used at a low heat curing temperature, and additionally is highly sensitive. SOLUTION: The heat-resistive resin composition contains 100 pts.mass of (A) a hydroxypolyamide having a repeating unit represented by a specific formula and 1 to 50 pts.mass of (B) at least one compound selected from the group consisting of polyester compounds having a number-average molecular weight of≥300 and polyalkylene glycol compounds having a number-average molecular weight of≥200. COPYRIGHT: (C)2013,JPO&INPIT |
