Electronic device with a mounting substrate with a roughened mounting surface and method for producing the same

摘要

An electronic device comprises an electronic part (14) bonded to a mounting substrate by sintering a silver bonding layer. The mounting substrate comprises a ceramic substrate (16) having a substantially rectangular planar shape, a metallisation (10) of aluminium or an aluminium alloy formed on one major surface of the ceramic substrate (16) and intended for mounting electronic parts (14) thereon and a heat radiating metal film (18) formed on the other major surface of the ceramic substrate (16). The mounting surface of the metallisation (10) is surface-processed so as to have a surface roughness of not less than 0.2 micrometres. A plating film (20) of nickel or a nickel alloy may be formed on the surface-processed mounting surface of the metallisation (10). An electronic part (14) is bonded to the mounting surface of the metallisation (10) (or to the plating film (20) if present) by a silver bonding layer (12), containing a sintered body of silver.