发明名称 Liquid ejection head and flexible wiring substrate used in liquid ejection head
摘要 A flexible wiring substrate that is used in a liquid ejection head having an element substrate provided with energy generating elements for generating energy for ejecting liquid includes: a bending portion; a base member including resin; electrical wiring lines formed on the base member and electrically connected to the element substrate, the electrical wiring lines extending over a ridge of the bending portion; and a metal layer that is arranged on an area of the base member in which no electrical wiring lines are provided and that is not electrically connected to the element substrate, the metal layer extending over the ridge.
申请公布号 US8740353(B2) 申请公布日期 2014.06.03
申请号 US201113284626 申请日期 2011.10.28
申请人 Canon Kabushiki Kaisha 发明人 Kimura Satoshi;Oikawa Satoshi;Kitabatake Kenji;Yamaguchi Yukuo
分类号 B41J2/14;B41J2/05 主分类号 B41J2/14
代理机构 代理人
主权项 1. A flexible wiring substrate that is used in a liquid ejection head having an element substrate provided with energy generating elements for generating energy for ejecting liquid, the flexible wiring substrate comprising: a bending portion; a base member including resin and having a bonding portion adjacent the bending portion and bonded to a surface on which the element substrate is provided; electrical wiring lines formed on the base member and electrically connected to the element substrate, the electrical wiring lines extending over a ridge of the bending portion; and a metal layer that is provided on the base member and that is not electrically connected to the element substrate, the metal layer extending over the ridge; and another metal layer that is provided on a reverse side of the bonding portion and that is not electrically connected to the element substrate, the other metal layer being not three-dimensionally bent.
地址 Tokyo JP