发明名称 Accelerator having acceleration channels formed between covalently bonded chips
摘要 An accelerator assembly includes a first chip and a second chip. An acceleration channel is formed into a surface of a first side of the first chip. The first side of the first chip is covalently bonded to a first side of the second chip such that the channel is a tubular void between the first and second chips. The channel has a tubular inside sidewall surface, substantially no portion of which is a metal surface. The channel has length-to-width ratio greater than five, and a channel width less than one micron. There are many substantially identical channels that extend in parallel between the first and second chips. In one specific example, the assembly is part of a Direct Write On Wafer (DWOW) printing system. The DWOW printing system is useful in semiconductor processing in that it can direct write an image onto a 300 mm diameter wafer in one minute.
申请公布号 US8742700(B1) 申请公布日期 2014.06.03
申请号 US201313952569 申请日期 2013.07.26
申请人 Transmute, Inc. 发明人 Hailey Kim L.;Conn Robert O.
分类号 H05H7/00 主分类号 H05H7/00
代理机构 代理人
主权项 1. An accelerator assembly comprising: a first chip having a first side and a second side, wherein an acceleration channel is formed into a surface of the first side of the first chip; and a second chip having a first side and a second side, wherein a surface of the first side of the second chip is covalently bonded to the surface of the first side of the first chip such that the acceleration channel is a tubular void between the first and second chips.
地址 Los Gatos CA US