Integrated 3-dimensional electromagnetic element arrays

摘要

Systems and methods for constructing integrated three dimensional electromagnetic element arrays using a bulk resonator are illustrated. In several embodiments, the integrated three dimensional electromagnetic element arrays include electromagnetic elements buried within the bulk resonator. In many embodiments, inclusion of a third dimension in the electromagnetic element array can alleviate or eliminate the trade-offs that are experienced in conventional integrated antennas by using the third physical dimension to provide an additional degree of freedom to manipulate electromagnetic boundary conditions in the near-field of the substrate, affecting both the resulting electromagnetic near- and far-fields. In several embodiments, three dimensional electromagnetic element arrays are formed by mechanically stacking substrates on which integrated planar circuits are formed (i.e. chips) using conventional die stacking techniques.

主权项

1. An integrated 3-dimensional electromagnetic element array, comprising:
a first planar integrated circuit, where the first planar integrated circuit comprises at least a first integrated electromagnetic element; and at least a second planar integrated circuit located on a different plane to the first planar integrated circuit, where the second planar integrated circuit comprises at least a second integrated electromagnetic element; wherein the first and second integrated electromagnetic elements are configured to control the near- and far-field pattern produced by the 3-dimensional electromagnetic element array; wherein the bulk resonator comprises a die stack; wherein the first planar integrated circuit is located on a first semiconductor substrate within the die stack; and wherein the second planar integrated circuit is located on a second semiconductor substrate within the die stack.