| 发明名称 |
Electronic device having cooling structure |
| 摘要 |
An electronic device having a heat dissipating component is provided. The electronic device includes a circuit board, a heat pipe which is disposed on a first side of the circuit board, a heat generating device which is disposed on a second side of the circuit board opposite to the first side, a heat sink placed which is disposed on a surface of the heat generating device and absorbs heat of the heat generating device, and a connecting member which penetrates through the circuit board and thermoconductively connects the heat pipe and the heat sink. |
| 申请公布号 |
US8743547(B2) |
申请公布日期 |
2014.06.03 |
| 申请号 |
US201113222493 |
申请日期 |
2011.08.31 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim Hee-dong |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a circuit board; a heat pipe which is disposed on a first side of the circuit board; a heat generating device which is disposed on a second side of the circuit board opposite to the first side of the circuit board; a heat sink which is interposed between the circuit board and the heat generating device, wherein the heat sink is disposed on the second side of the circuit board and absorbs heat generated by the heat generating device; and a connecting member which penetrates through the circuit board and thermoconductively connects the heat pipe and the heat sink.
|
| 地址 |
Suwon-si KR |
