| 主权项 |
1. A method for fabricating a semiconductor light emitting device, the method comprising:
forming a buffer layer on a substrate; forming a first GaN based semiconductor layer on the buffer layer; forming an active layer on a first surface of the first GaN based semiconductor layer; forming a second GaN based semiconductor layer on the active layer; removing the substrate; forming uneven patterns at a second surface of the first GaN based semiconductor layer, the second surface being opposite the first surface of the first GaN based semiconductor layer; and forming a first electrode with uneven patterns corresponding to the uneven patterns at the first GaN based semiconductor layer, and forming a second electrode on the second GaN based semiconductor layer such that current is provided to the semiconductor light emitting device including the first GaN based semiconductor layer, the active layer, and the second GaN based semiconductor layer through the first electrode and the second electrode, wherein the first electrode is a single layer and includes a top surface having a shape corresponding to the uneven patterns at the first GaN based semiconductor layer and a bottom surface being the outermost surface of the semiconductor light emitting device, wherein the uneven patterns at the first GaN based semiconductor layer directly contact the top surface of the first electrode, wherein a light emitting structure including the first GaN based semiconductor layer, the active layer, and the second GaN based semiconductor layer generates light, wherein the light emitting structure directly contacts the first electrode, wherein the first GaN based semiconductor layer only includes GaN based semiconductor materials, wherein the uneven patterns at the second surface of the first GaN based semiconductor layer are directly formed in the first GaN based semiconductor layer, wherein the first GaN based semiconductor layer is an n-type semiconductor layer, and the second GaN based semiconductor layer is a p-type semiconductor layer, wherein the uneven patterns of the first GaN based semiconductor layer are formed at different intervals, wherein at least the first electrode is formed over the entire second surface of the first GaN based semiconductor layer, or at least the second electrode is formed over the entire surface of the second GaN based semiconductor layer, wherein removing the substrate causes the buffer layer to be the bottom-most layer, and wherein an entire surface of the first electrode contacts the first GaN based semiconductor layer.
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