Laser apparatus for singulation, and a method of singulation

摘要

An apparatus 101 for singulating an object is disclosed. The apparatus 101 comprises a laser 103 configured to emit a laser beam 105 with a Gaussian irradiance profile, as well as a beam-shaping device 115 configured to reshape the Gaussian irradiance profile of the laser beam 105 emitted from the laser 103. In particular, the beam-shaping device 115 has a plurality of aspherical lenses 117, 119 to redistribute irradiance of the laser beam 105, so as to reduce variation of the irradiance in an effective irradiation spectrum of the laser beam 105 for singulating the object. By redistributing the irradiance of the laser beam 105, irradiation energy may be more efficiently delivered to the semiconductor wafer 102 for laser singulation, compared with conventional laser beams with Gaussian irradiance profiles which are non-uniform. A method of singulating an object is also disclosed.

主权项

1. An apparatus for singulating an object, the apparatus comprising:
a laser configured to emit a laser beam with a Gaussian irradiance profile; and a beam-shaping device configured to reshape the Gaussian irradiance profile of the laser beam emitted from the laser, the beam-shaping device having at least first and second aspherical lenses configured to redistribute irradiance of the laser beam, wherein the first aspherical lens is arranged to cause the laser beam to converge and the second aspherical lens is arranged to subsequently cause the converged laser beam to diverge so as to enhance uniformity of the irradiance profile of the laser beam for singulating the object.