发明名称 Expansion apparatus for serial advanced technology attachment dual in-line memory module and motherboard for supporting the expansion apparatus
摘要 A motherboard assembly includes a motherboard and an expansion apparatus. The motherboard includes a first expansion slot. An edge connector is set on a bottom side of the expansion apparatus to be detachably engaged in the first expansion slot. A number of SATA interfaces and a number of second expansion slots are arranged on the expansion apparatus, and are connected to signal pins and power pins of the edge connector.
申请公布号 US8743552(B2) 申请公布日期 2014.06.03
申请号 US201113217161 申请日期 2011.08.24
申请人 Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.;Hon Hai Precision Industry Co., Ltd. 发明人 Tian Bo;Wu Kang
分类号 H05K5/00;H05K7/00;G06F1/16;H05K7/16;H05K1/14;H05K1/00;H05K1/18;H01R9/00;H05K1/11;H05K1/02;G06F3/06 主分类号 H05K5/00
代理机构 代理人
主权项 1. An expansion apparatus for a serial advanced technology attachment dual in-line memory module (SATA DIMM), the expansion apparatus comprising: a circuit board; a plurality of expansion slots mounted on the circuit board, to receive a plurality of SATA DIMM modules; a plurality of serial advanced technology attachment (SATA) interfaces mounted on the circuit board and connected to SATA connectors of the plurality of SATA DIMM modules, wherein the number of the plurality of SATA interfaces is the same as the number of the plurality of expansion slots; and an edge connector set on a bottom side of the circuit board, the edge connector comprising a plurality of power pins connected to the plurality of expansion slots for providing voltages to the plurality of expansion slots, a plurality of signal pins connected to the plurality of SATA interfaces for providing SATA signals to the plurality of SATA interfaces, and a plurality of ground pins being grounded.
地址 Shenzhen CN