发明名称 Biofouling control
摘要 A system and method for stabilizing bromine in an industrial water system by monitoring and flexible dosing of chlorine oxidant and halide ion stabilizer residual levels. The system comprises chlorine oxidant, and a halide ion source with a halogen stabilizer.
申请公布号 US8741157(B2) 申请公布日期 2014.06.03
申请号 US20080179949 申请日期 2008.07.25
申请人 Nalco Company 发明人 Wetegrove Robert L.;Cooper Andrew J.;Hatch Steven R.
分类号 C02F1/76;C02F1/72;C02F1/68;A62D3/00;C01B11/00;C11D3/395;C23F11/00;A61L2/18 主分类号 C02F1/76
代理机构 代理人
主权项 1. A method for control of biofouling in an industrial water system comprising copper surfaces, the method including the steps of: (a) concurrently monitoring in an industrial water system both a chlorine oxidant concentration and a concentration of sodium sulfamate; (b) providing a chlorine oxidant source; (c) providing a mixture of sodium sulfamate and bromide ion source the molar ratio of sodium sulfamate to bromide ion source in the mixture being within the range of 1:1 to 1:4; (d) comparing the monitored chlorine oxidant concentration to a pre-determined chlorine oxidant concentration known to function as an effective biocide in the industrial water system and appropriately adding the chlorine oxidant source at a rate and in an amount sufficient to achieve at least the pre-determined chlorine oxidant concentration, said pre-determined chlorine oxidant concentration being within the range of between 2 mg/liter and 0.2 mg/liter and; (e) comparing the monitored concentration of sodium sulfamate to a predetermined concentration of sodium sulfamate and bromide, source mixture known to effectively control foulant in the industrial water system and appropriately adding the mixture of sodium sulfamate and bromide ion source in an amount sufficient to achieve at least the pre-determined sodium sulfamate concentration between 0.01 mg/liter to 100 mg/liter, the adding to the water system of the mixture of sodium sulfamate and bromide ion source being independent of whether chlorine oxidant is being concurrently added to the system; wherein corrosion in the copper surfaces occurs at a rate which is at least 15 times slower to about 28 times slower than would occur were at least the same amount of sodium sulfamate added to the system in the absence of the bromide ion source.
地址 Naperville IL US