Wafer-level molded structure for package assembly

摘要

An integrated circuit structure includes a bottom die; a top die bonded to the bottom die with the top die having a size smaller than the bottom die; and a molding compound over the bottom die and the top die. The molding compound contacts edges of the top die. The edges of the bottom die are vertically aligned to respective edges of the molding compound.

主权项

1. An integrated circuit structure comprising:
a bottom die; a top die bonded to the bottom die, wherein the top die has a size smaller than the bottom die; a molding material over and in between the bottom die and the top die, wherein the molding material extends to and contacts edges of the top die and extends along and contacts an entirety of a top surface of the top die, and wherein edges of the bottom die are vertically aligned with respective edges of the molding material; and a package substrate underlying and bonded to the bottom die using solder balls.