| 发明名称 |
Polishing composition containing polyether amine |
| 摘要 |
The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system. |
| 申请公布号 |
US8741009(B2) |
申请公布日期 |
2014.06.03 |
| 申请号 |
US20090462067 |
申请日期 |
2009.07.29 |
| 申请人 |
Cabot Microelectronics Corporation |
发明人 |
Dysard Jeffrey M.;Feeney Paul M.;Anjur Sriram P.;Johns Timothy P.;Xin Yun-Biao;Wang Li |
| 分类号 |
C09K3/14;B24D3/02;C09C1/68;C09G1/02 |
主分类号 |
C09K3/14 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A method of chemically-mechanically polishing a substrate, which method comprises:
(i) contacting a substrate with a chemical-mechanical polishing composition comprising:
(a) an abrasive,(b) a liquid carrier, and(c) a compound selected from the group consisting of
(1) a compound of the Formula (I) wherein x=2-6,(2) a compound of the Formula (II) wherein x+z=2-4 and y=1-50, and(3) combinations thereof, (ii) moving the polishing component relative to the substrate, and (iii) abrading at least a portion of the substrate to polish the substrate.
|
| 地址 |
Aurora IL US |
