| 发明名称 |
Layout designs with via routing structures |
| 摘要 |
An approach for providing layout designs with via routing structures is disclosed. Embodiments include: providing a gate structure and a diffusion contact on a substrate; providing a gate contact on the gate structure; providing a metal routing structure that does not overlie a portion of the gate contact, the diffusion contact, or a combination thereof; and providing a via routing structure over the portion and under a part of the metal routing structure to couple the gate contact, the diffusion contact, or a combination thereof to the metal routing structure. |
| 申请公布号 |
US8741763(B2) |
申请公布日期 |
2014.06.03 |
| 申请号 |
US201213465129 |
申请日期 |
2012.05.07 |
| 申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Ma Yuansheng;Kye Jongwook;Levinson Harry;Yoshida Hidekazu;Rashed Mahbub |
| 分类号 |
H01L21/44;H01L23/528 |
主分类号 |
H01L21/44 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
providing a gate structure and a diffusion contact on a substrate; providing a gate contact on the gate structure; providing a metal routing structure that does not overlie a portion of the gate contact, the diffusion contact, or a combination thereof; and providing a via routing structure over the portion and under a part of the metal routing structure to couple the gate contact, the diffusion contact, or a combination thereof to the metal routing structure, wherein the diffusion contact is provided in a diffusion gap region in the substrate.
|
| 地址 |
Grand Cayman KY |
