Circuit board and semiconductor module including the same

摘要

In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a cross section, such that a first side of the first metal core faces a first side of the second metal core; a first electrode electrically connected to the first side of the first metal core; a second electrode electrically connected to the first side of the second metal core facing the first metal core; and a dielectric layer between the first and second electrodes.

主权项

1. A circuit board comprising:
a metal core including a first metal core and a second metal core spaced apart from the first metal core in a first direction when viewed as a cross section, such that a first side of the first metal core faces a first side of the second metal core, wherein the first metal core is a solid metal core, and the second metal core is a solid metal core; a first electrode electrically connected to the first side of the first metal core; a second electrode electrically connected to the first side of the second metal core facing the first metal core; a dielectric layer between the first and second electrodes; a first conductive adhesion portion electrically connecting the first side of the first metal core and the first electrode; a first insulating layer covering and contacting the conductive surface of the metal core; and a second conductive adhesion portion electrically connecting the first side of the second metal core and the second electrode, wherein the dielectric layer, first electrode, and second electrode form a capacitor electrically connected to the first metal core and second metal core through the first conductive adhesion portion and second conductive adhesion portion respectively.