发明名称 |
Printed wiring board |
摘要 |
A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad. |
申请公布号 |
US8743557(B2) |
申请公布日期 |
2014.06.03 |
申请号 |
US201213484448 |
申请日期 |
2012.05.31 |
申请人 |
IBIDEN Co., Ltd. |
发明人 |
Mano Yasuhiko;Kato Shinobu;Morita Haruhiko;Kurokawa Satoshi |
分类号 |
H05K7/00;H05K1/11 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
1. A printed wiring board, comprising:
a packaging substrate having a plurality of pads; and a transmission substrate mounted on the plurality of pads of the packaging substrate, wherein the packaging substrate has a pad group comprising a plurality of pads configured to mount an electronic component, the plurality of pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.
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地址 |
Ogaki-shi JP |